Precision Interconnect Solutions
Wire bonding remains one of the most reliable and versatile interconnect technologies in semiconductor packaging and micro-assembly, particularly where electrical performance, mechanical integrity, and long-term reliability are critical.
Wire Bonding Sectors we service
At ICT, we provide precision ultrasonic wedge wire bonding using aluminium and gold wire, supporting complex assemblies for photonics, medical electronics, MEMS sensors, quantum devices, and advanced semiconductor research.
Unlike high-volume packaging houses, ICT focuses on R&D, prototyping, and low-volume production, offering customers direct access to experienced engineers, adaptable processes, and meticulous quality control. This makes us an ideal partner for universities, research organisations, and technology developers working at the forefront of innovation.
Wire Bonding Services we offer
Our wire bonding processes are engineered to deliver repeatable, high-strength interconnections while protecting delicate die, substrates, and surrounding structures.
Ultrasonic Wedge Wire Bonding.
We specialise in manual ultrasonic wedge bonding, enabling precise control over each individual bond. This approach is particularly well suited to optoelectronic, hybrid, and non-standard assemblies where automated systems lack the required flexibility. Bonding parameters—including ultrasonic energy, bonding force, and bond time—are carefully optimised to achieve strong metallurgical bonds with minimal thermal and mechanical stress.
Wire Materials & Diameters
We bond using aluminium and gold wire in diameters from 15µm to 50µm, accommodating both fine-pitch interconnects and more robust connections. This range supports applications from sensitive MEMS structures to photonic and medical devices requiring enhanced mechanical durability.
Substrate & Package Compatibility
Our wire bonding services support a wide variety of substrates and packages, including:
- Ceramic substrates (alumina and aluminium nitride)
- Printed circuit boards (PCBs)
- Lead frames and custom carriers
These capabilities are frequently used in defence electronics, biotech instrumentation, cryogenic quantum packages, and photonic modules.
Inspection & Bond Integrity Testing
All wire bonds are subject to visual inspection under magnification and validated using Dage pull testing. This ensures consistent bond strength, electrical reliability, and compliance with performance expectations for high-reliability and mission-critical applications.
Our Wire Bonding Applications include
- Laser diode and photonic module interconnects
- MEMS sensor assemblies for miniaturised electronics
- Quantum device packaging for cryogenic and research environments
- Semiconductor prototypes requiring fine-pitch or non-standard bonding
- Medical and implantable electronic assemblies
Why Choose ICT for Wire Bonding?
- ICT has over 30 years’ experience in precision micro-assembly
- Our specialist expertise in manual ultrasonic wedge bonding
- Ideal for R&D, prototypes, and low-volume production
- In-house pull testing and inspection for assured reliability
- Direct collaboration with experienced engineers
Want more information or a quote?
If you have a wire bonding job that you would like to discuss with an ICT engineer,,
please call us now on +44 (0)1932 509911.
