Wafer Processing Services
ICT offers customers reliable wafer processing services including
Precision Wafer Dicing, Wafer Thinning
Material Expertise & Process Control
Wafer Processing
Precision Wafer Processing for Advanced Engineering Applications
Wafer processing is a fundamental stage in advanced device manufacturing, enabling the production of high-performance, miniaturised components for sectors including photonics, quantum technologies, medical devices and semiconductors. At ICT, we specialise in precision wafer dicing and wafer thinning, supporting applications where dimensional accuracy, surface integrity and repeatability are critical.
With over 30 years’ experience, we support innovators across aerospace, defence, bioelectronics and next-generation electronics, delivering reliable wafer processing solutions for both R&D prototypes and low-to-medium volume production.
Wafer Processing Services we offer
ICT provides wafer processing solutions designed for high accuracy and reliability across demanding applications. Our processes are optimised to maintain dimensional integrity and surface quality throughout dicing and thinning operations.
Precision Wafer Dicing
Using advanced diamond-blade dicing systems, ICT can singulate wafers, ceramics and specialist substrates up to 200mm in diameter. Process parameters such as blade type, spindle speed, feed rate and coolant flow are tightly controlled to minimise chipping, reduce edge damage and maximise die yield. This ensures consistent quality for fragile and high-value wafers used in photonic integrated circuits, MEMS devices and semiconductor packaging.
Wafer Thinning (Back Grinding)
We offer precision back grinding services, reducing wafer thickness down to 100µm. Wafer thinning is essential for applications requiring ultra-thin profiles, improved thermal performance and enhanced integration flexibility. Our controlled thinning processes allow us to support demanding environments such as quantum substrates, MEMS sensors and implantable medical electronics.
Material Expertise & Process Control
We process a wide range of materials including silicon, sapphire, quartz, glass, ceramics, and compound semiconductors such as GaAs and GaN. All operations are supported by robust process control and inspection protocols to verify dimensional accuracy and surface quality, ensuring compliance with customer specifications and industry standards.
Wafer Processing Applications include
- Photonic integrated circuits for high-speed optical communications
- Quantum computing and research substrates
- MEMS sensors for automotive and industrial systems
- Semiconductor prototypes and advanced packaging
- Medical sensors and implantable electronic devices
Why Choose ICT?
- Our precision equipment optimised for fragile and complex wafers
- Proven expertise supporting R&D through to production
- ISO-certified workflows and quality assurance
Wafer Processing Articles
Read our latest articles about Wafer Processing and related topics
What is Wafer Dicing?
Wafer Dicing is a critical process in the semiconductor industry, which involves the separation of individual dies from a wafer. The process is essential in the production of electronic devices such as microprocessors, memory chips, and sensors. Wafer dicing is typically performed after the wafer has undergone various fabrication processes, such as photolithography, etching, and deposition, to create multiple layers of integrated circuits on a single substrate…
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Need Precision Wafer Processing?Contact Us for expert dicing and thinning solutions or call us now on +44 (0)1932 509911.
