ICT’s Wafer Dicing Services
As part of ICT’s micro component manufacturing processes, ICT offers customers a reliable wafer dicing service. Wafer dicing processes are undertaken at ICT’s manufacturing facility in Shepperton, UK, to meet customers’ tight production schedules.
Experienced ICT engineers use an ADT dicing machine and a semi-automatic high performance Disco saw to produce wafer dicing that is free of defects. The confidence clients have in the quality of ICT’s products and processes make it a well respected partner and supplier.
Wafer dicing of silicon, sapphire and other materials, up to 200 mm in diameter, can be undertaken. In addition, ICT’s bespoke design service and credentials make it well suited to assist customers with any new product development or product improvement projects.
ICT’s wafer dicing processes routinely meet customers’ tight tolerances. With a wide range of dicing blades and materials available, we are able to tailor the wafer dicing processes offered to suit many individual customer requirements.
ICT’s Wafer Dicing equipment include
- Three ADT 7100
- Disco DAC551
Want more information or a quote?
If you have a wafer dicing job that you would like to discuss with an ICT engineer,
please call us now on +44 (0)1932 509911.