Thin Film Deposition
Thin film deposition is a fundamental enabling process for advanced semiconductor, photonic, and microelectronic devices, where precisely controlled material layers are essential for performance and reliability.
Thin Film Deposition Sectors we service
At ICT, we provide DC magnetron sputtering services for high-purity metal coatings, supporting R&D, prototyping, and low-volume production across photonics, quantum technologies, medical electronics, and MEMS sensors. Our expertise allows customers to develop complex, high-performance devices without the constraints of high-volume manufacturing.
Thin Film Deposition services we offer
ICT delivers thin film deposition using a custom-built 24-inch DC magnetron sputtering system, designed to achieve uniform, repeatable coatings with excellent adhesion. The system incorporates three independent sputtering sources, enabling sequential deposition, multilayer stacks, and co-sputtering for alloy film development. This flexibility is particularly valuable for research-led projects and emerging technologies requiring tailored material solutions.
We work with high-purity sputtering targets including titanium (Ti), platinum (Pt), and gold (Au), providing conductive, barrier, adhesion, and reflective layers for demanding applications.
Substrates are prepared using ultrasonic and plasma cleaning processes within ISO-standard clean air cabinets, ensuring optimal surface cleanliness prior to deposition. Deposition parameters such as power, pressure, and time are tightly controlled to achieve consistent film thickness, adhesion, and surface quality.
Applications for Thin Film Deposition
Thin film deposition at ICT enables a wide range of applications, including reflective and conductive coatings for photonic devices, diffusion barrier layers for quantum and semiconductor packaging, biocompatible coatings for medical sensors, MEMS device coatings for enhanced functionality, and optical coatings for laser diode assemblies.
By combining advanced sputtering capability with meticulous surface preparation and inspection, ICT delivers reliable thin film solutions tailored to innovation-driven industries.
Quality Assured
ICT undertakes rigorous pull testing to record and monitor the quality of the metalisation process to ensure compliance with stringent standards, on a batch by batch basis.
Where metalisation is used for wire bonding purposes, a pull test using wire bonding is used. ICT also has a Dage pull tester.
All components go through an OPTIMAL automatic cleaning system prior to deposition.
For more information on ICT’s quality assurance and quality control procedures, go to ICT’s quality assurance.
WHY CHOOSE ICT
• Advanced sputtering technology for high-purity coatings
• Flexible solutions for R&D and low-volume production
• Enhanced reliability with plasma cleaning and automated substrate preparation
Want more information or a quote?
Ready to discuss your Thin Film Deposition requirements?
Please Contact us or call us now on +44 (0)1932 509911.
