Die Bonding & Chip-on-Board Services
Precision Assembly for Advanced Devices
Die bonding and chip-on-board (CoB) assembly are critical stages in semiconductor and microelectronic packaging, directly influencing device performance, reliability, and long-term stability. At ICT, we provide precision manual die attach and CoB assembly services designed specifically for R&D, prototyping, and low-volume production environments where flexibility, accuracy, and process control are essential.
Die Bonding Sectors we service
With over 30 years of experience, we support innovation across photonics, quantum technologies, medical electronics, MEMS sensors, and advanced semiconductor devices.
What We Offer
Die Bonding Services we offer
Our die bonding services are optimised for applications requiring careful handling of delicate or non-standard components. Using manual pick-and-place tools and precision adhesive dispensing, we achieve accurate die placement on ceramic substrates, PCBs, and lead frames. This approach allows us to accommodate unusual die geometries, bespoke substrates, and evolving designs without the limitations imposed by automated systems.
Advanced Preparation
To enhance bond integrity and long-term reliability, plasma surface preparation is employed prior to die attach. This process improves surface energy and adhesion performance, which is particularly important for devices operating in demanding thermal or environmental conditions.
Epoxy-based die attach materials are thermally cured in controlled ovens to ensure consistent bond strength and dimensional stability.
Quality assurance is embedded throughout the process. High-magnification optical inspection and precision metrology are used to verify alignment, bond quality, and compliance with customer specifications. This level of control makes manual die bonding ideal for prototype development, custom assemblies, and specialised low-volume builds where precision outweighs throughput.
By combining flexible manual processes with advanced preparation and inspection capabilities, ICT enables reliable chip-on-board assemblies that support cutting-edge research and accelerate time to market.
Die Bonding Applications we support
- Photonic assemblies requiring accurate chip placement
- Quantum computing modules with bespoke packaging
- MEMS sensor integration for R&D and validation
- Medical electronics using epoxy die bonding
- Semiconductor CoB(Chip on Board) assemblies for low-volume production
WHY CHOOSE ICT
- Manual die bonding optimised for R&D and custom assemblies
- Enhanced adhesion through plasma surface preparation
- Precision inspection supporting high-reliability devices
- Proven expertise across advanced technology sectors
Want more information or a quote?
Please contact our team today for more information or to discuss your die bonding or chip-on-board requirements.
or call now on+44 (0)1932 509911.
