+44 (0)1932 509911 info@ICT-ltd.co.uk

Processes and Services


High quality micro precision processes & services



ICT Processes and Services

At ICT’s UK precision component manufacturing facility, we provide high quality micro precision processes

Precision Lapping services

Precision Lapping

A tailored service is provided to all clients

Micro Machining Services

Micro Machining

State of the art wafer dicing machines

Thin Film Deposition Services

Thin Film Deposition

Metalisation and passivation

Wire Bonding Services

Wire Bonding

Aluminium or gold wedge bonding

Wafer Dicing Services

Wafer Dicing

ICT offers customers a reliable wafer dicing service

Product Development

Product Development

Product design, development and prototyping

Want more information or a quote?

If you would like to discuss any of these processes with an ICT engineer, call now on +44 (0)1932 509911