ICT Processes and Services
At ICT’s UK precision component manufacturing facility, we provide high quality micro precision processes
Precision Lapping
A tailored service is provided to all clients
Micro Machining
State of the art wafer dicing machines
Thin Film Deposition
Metalisation and passivation
Wire Bonding
Aluminium or gold wedge bonding
Wafer Dicing
ICT offers customers a reliable wafer dicing service
Product Development
Product design, development and prototyping
Want more information or a quote?
If you would like to discuss any of these processes with an ICT engineer, call now on +44 (0)1932 509911
