Precision Lapping & Polishing Services

Precision Lapping

Precision lapping and polishing are critical surface finishing processes used to achieve exceptional flatness, tight dimensional tolerances, and controlled surface finishes.

These capabilities are essential for advanced technologies in photonics, semiconductor manufacturing, medical electronics, MEMS, and quantum research, where surface integrity has a direct impact on device performance, reliability, and yield.

At ICT, we combine high-precision lapping and polishing equipment with advanced metrology to deliver consistent, repeatable results for R&D, prototyping, and low-volume production. With over 30 years of experience in precision engineering, we support customers who require flexibility, traceability, and confidence in every processed component.

Precision Lapping Services we offer

ICT provides adaptable lapping and polishing solutions tailored to a wide range of materials and component geometries.

Lapping & Polishing Equipment

We operate small to large-format lapping and polishing systems capable of processing components up to 7.5 inches in diameter. A selection of plate materials allows optimisation for different substrates, including semiconductors, ceramics, and optical materials.

Surface Quality & Dimensional Control

Process parameters such as applied pressure, rotational speed, and slurry composition are carefully controlled to achieve consistent flatness, parallelism, and surface finish across each batch.

Advanced Measurement & Quality Assurance

Quality is verified using:

• Granite reference plates for flatness assessment
• Calibrated gauge blocks for dimensional verification
• High-accuracy contact probes for size and flatness measurement
• Optical video measurement systems for non-contact inspection of micro-scale features

Precision Lapping & Polishing Applications

• Optical substrates for photonics and imaging systems
• Semiconductor wafers requiring ultra-flat, damage-free surfaces
• MEMS components with tight surface finish requirements
• Ceramic substrates for high-frequency and RF electronics
• Quantum device substrates demanding dimensional stability

Why Choose ICT?

• Multiple plate types enabling versatile material processing
• Integrated metrology ensuring compliance with strict tolerances
• ISO 9001 accredited processes for quality and traceability
• Ideal for projects where precision matters more than volume