Micro Assembly
Micro assembly is a critical capability in the manufacture of advanced electronic and photonic devices, enabling the precise integration of miniature and delicate components into highly functional systems. At ICT, we specialise in manual micro assembly services designed specifically for R&D, prototyping, and low-volume production, where flexibility, control, and accuracy are essential.
Micro Assembly Sectors we service
Our micro assembly expertise supports demanding sectors including photonics, quantum technologies, medical electronics, MEMS sensors, and semiconductor research. By combining skilled operators with controlled processes, we help innovators develop bespoke assemblies and advanced packaging solutions without the constraints of automated production.
Micro Assembly Services
We deliver micro assembly services optimised for precision and reliability, supported by advanced preparation, bonding, and inspection techniques.
Component Handling & Placement
Miniature components are assembled by experienced technicians using high-magnification microscopes, ensuring accurate alignment and secure integration for complex, multi-part assemblies.
Surface Preparation
Plasma cleaning enhances surface energy and cleanliness, improving adhesion performance for assemblies requiring epoxy bonding, wire bonding, or hybrid interconnects.
Adhesive Application & Curing
Precision adhesive dispensing combined with controlled thermal curing delivers robust mechanical stability and consistent electrical performance.
Inspection & Quality Control
High-resolution metrology and visual inspection systems verify alignment, bond quality, and assembly integrity, ensuring compliance with customer specifications and design tolerances.
Manual micro assembly offers distinct advantages for specialist applications, including rapid prototype development, support for non-standard components, cost-effective low-volume production, and reduced risk when handling sensitive or fragile devices.
Micro Assembly Applications include
- Optical assemblies for photonics and imaging systems
- Quantum device integration with multiple micro-scale components
- MEMS sensor packaging for miniaturised systems
- Medical electronics modules for diagnostic and laboratory equipment
- Prototype assemblies for semiconductor and advanced R&D projects
Why Choose ICT?
- Flexible, manual assembly processes tailored to R&D and custom designs
- Enhanced reliability through plasma cleaning and precision inspection
- Over 30 years’ experience supporting advanced technology sectors
Want more information or a quote?
Ready to discuss your micro assembly requirements?
Contact Us or please call us now on +44 (0)1932 509911.
