by Alex Crane | Sep 30, 2026 | Semiconductors, Wafer Dicing, Wafer Processing
Micro-Electro-Mechanical Systems (MEMS) have become an important enabling technology across aerospace and defence applications. Their ability to combine microscopic mechanical structures with electronic sensing in compact packages makes MEMS devices particularly...
by Alex Crane | Sep 20, 2026 | Semiconductors, Wafer Dicing, Wafer Processing, Wire Bonding
Micro-Electro-Mechanical Systems (MEMS) sensors are found in applications ranging from medical devices and aerospace systems to industrial instrumentation, navigation equipment and wearable technology. Although the finished sensor may measure only a few millimetres,...
by Alex Crane | Sep 13, 2026 | Semiconductors, Wafer Dicing, Wafer Processing
Pressure is one of the most widely measured physical parameters in modern electronic systems. From monitoring blood pressure inside medical equipment to measuring air pressure in aerospace systems, engineers increasingly need sensors that combine small dimensions with...
by Johnny Konstants | Sep 6, 2026 | Semiconductors, Wire Bonding
From Concept to Prototype For start-ups, universities, research institutes and technology innovators, transforming a semiconductor concept into a working prototype is a critical stage of product development. A successful prototype allows engineers to validate...
by Johnny Konstants | Sep 1, 2026 | Semiconductors, Wafer Dicing
For semiconductor start-ups, universities, research institutes and technology innovators, moving from a promising concept to a working prototype can present a significant manufacturing challenge. Developing a semiconductor device requires access to specialist...
