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ICT processes and services
At ICT's UK precision component manufacturing facility, we provide high quality micro precision processes such as:
- Precision lapping
- Micro machining
- Thin film deposition (metalisation and passivation)
- Wafer dicing
- Wire bonding.
Want more information or a quote?
If you would like to discuss any of these processes with an ICT engineer, please complete the enquiry form or call now on + 44 (0)1932 592215.
INFORMATIC COMPONENT TECHNOLOGY LIMITED
Shepperton Studios, Studios Road,
Shepperton, Middlesex, TW17 OQD, England.
Tel: +44 (0)1932 592215 Fax: +44 (0)1932 564753
Email:
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